As a highly thermal-conductive filler and radiating filler material
In recent years, semiconductor devices and electronic devices for LEDs are getting smaller and smaller, moving toward high-density integration. As a result, thermal management will become a problem and highly thermal-conductive filler will be needed in the fields of thermal grease, thermal sheets and more. Our product has highly thermal-conductive and radiating performance, and is a very stable, safe material. We have an assortment of high-performance spherical SiC products, and we’ll continue pursuing the unlimited possibility of SiC.
Characteristics of SIC
| Thermal radiation rate（ε） | 0.9 |
| Thermal conductivity (W/m·K) | 270 |
| The rate of thermal expansion（10-6/ °C） 20 °C | 4.5 |
| luminous reflectance (240nm to 2,600nm) |
18 % |
| Hardness | New Mohs hardness: 13 (diamond new Mohs hardness: 15) |
| True specific gravity | 3.15 to 3.20 g/cm3 |
| Corrosion resistance | Chemically stable, and corrosion resistance to acid and alkali. |
Thermal radiation rate (reference value)
| Name | Thermal radiation rate | Name | Thermal radiation rate |
| Silicon carbide | 0.9 | Aluminum oxide | 0.4 |
| Aluminum | 0.2 | Copper | 0.1 |
| Iron | 0.3 | Zirconia oxide | 0.7 |
| Zinc oxide | 0.1 | Magnesium oxide | 0.4 |
Thermal conductivity of silicon carbide and other ceramics & metals (W/(m·k))
Note: numbers in parentheses are thermal conductivity values.
See thermal conductivity values, document values.
See thermal conductivity values, document values.
- SiC fine powder product (SHINANO-RUNDUM CP/GP)
- Spherical SiC product (SSC series)
- High thermal conductive product (X-12)
* More details about the high thermal conductive products,
please feel free to contact us.
please feel free to contact us.
